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Thermal conductive double sided tape is a specialized adhesive tape specifically designed for transferring heat within electronic devices and other systems requiring thermal management. Its primary characteristic is its dual-sided adhesiveness, enabling the formation of a secure bond between two contacting surfaces while also exhibiting excellent thermal conductivity.

Thermal management design for LiDAR is a comprehensive engineering endeavor encompassing heat source identification, selection of thermal materials and technologies, component layout for heat dissipation, active and passive cooling strategies, intelligent temperature control, packaging and material choices, and thorough consideration of environmental adaptability. By effectively integrating these strategies, LiDAR systems can maintain excellent thermal stability across diverse operating conditions, ensuring their long-term reliability.

The right storage practices aim to maintain the freshness and stability of the thermal grease, thus extending its lifespan. If properly stored according to the guidelines mentioned, thermal grease can remain in good condition for several months to years.

Thermal grease heat sink paste plays a pivotal role in improving the heat dissipation efficiency of MOSFETs by filling gaps, enhancing heat transfer, providing electrical insulation, and adapting to temperature changes and mechanical stress.

Thermal conductive silicone pads, as an efficient thermal conduction interfece material, have increasingly gained attention in recent years for their application in MOSFET cooling solutions. These pads feature excellent thermal conductivity, electrical insulation, aging resistance, and corrosion resistance, efficiently transferring the heat generated by MOSFETs away and ensuring normal device operation.

Although thermal silicone pads and thermal grease are common thermal conductivity interface materials, they have differences in physical forms, use methods, performance characteristics, and application scenarios. Although it can be replaced in some cases, whether it can replace it depends on specific heat dissipation requirements, assembly conditions, and equipment design requirements.

Thermal management is an engineering discipline that involves scientifically designing and implementing effective heating, cooling, or insulation measures to control the distribution of heat within or on the surface of a specific system or device, as well as the transfer of heat and temperature levels, ensuring that the system operates within an appropriate temperature range under expected working conditions.

Thermal grease, also known as heat sink compound or thermal paste, is a material widely used for heat dissipation in electronic devices. Its excellent thermal conductivity effectively transfers heat from high-temperature components to the heat sink, thereby ensuring the normal operation of the equipment. However, many people experience suboptimal cooling results or even device malfunctions when using thermal grease due to improper application methods. Therefore, mastering the correct method of applying thermal grease is crucial.

Thermal conductive materials are specifically designed to efficiently transfer heat, characterized by high thermal conductivity, enabling effective dissipation of heat from one area or component to another, thereby helping to maintain internal temperature equilibrium, prevent localized overheating, and ensure stable operation and prolonged service life of equipment.

Thermal grease is a compound specifically designed to enhance thermal conductivity, typically existing in a paste-like form. It is primarily composed of silicone oil as the base oil, augmented with high thermally conductive fillers (such as aluminum oxide, boron nitride, graphite, etc.), antioxidants, and thickeners.

The application of thermally conductive silicone pads in heat sinks is primarily based on their outstanding thermal conductivity and material properties. In electronic devices, there are often small i...